Development of Low-Residual-Stress Photosensitive Adhesive Materials for Wafer-Scale Microfluidic Device Fabrication

We have previously developed a photosensitive adhesive material that enables microfluidic channel structure formation and subsequent bonding to cover with the aim of simplifying process wafer-scale device fabrication. However, curing required heat treatment at 200 ℃ 180 ℃, respectively, resulting in generation relatively high residual thermal stress. This may lead delamination, warping, cracking depending on application environment. Therefore, present study, we designed new platform which patterning, bonding, processes are based ultraviolet (UV) reaction polyfunctional acrylate, tackiness epoxy resin, UV/thermal resin order achieve low stress through low-temperature processing. Proof concept was conducted evaluation various physical properties system found type material, bonded cured lower temperatures 100 120 had 10 MPa good insulation reliability. is promising for applications such as cooling devices semiconductor chips, where long-term reliability required.